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Gehäuse für integrierte Schaltungen, z.B. auch Mikrocontroller

Gehäuseklassen

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Gehaeuseformen.gif


Surface Mount Device

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Surface mount packages.gif


BGA
Ball Grid Array
BQFP
Bumpered Quad Flat Pack
CBGA
Ceramic Ball Grid Array
CFP
Ceramic Flat Pack
CPGA
Ceramic Pin Grid Array
CQFP
Ceramic Quad Flat Pack
TBD
Ceramic Lead-Less Chip Carrier
DLCC
Dual Lead-Less Chip Carrier (Ceramic)
FBGA
Fine-pitch Ball Grid Array
fpBGA
Fine Pitch Ball Grid Array
JLCC
J-Leaded Chip Carrier (Ceramic)
LCC
Leaded Chip Carrier [also Leadless]
LCCC
Leaded Ceramic Chip Carrier;
LFBGA
Low-Profile, Fine-Pitch Ball Grid Array
LGA
Land Grid Array [Pins are on the Motherboard, not the socket]
MLCC
Micro Leadframe Chip Carrier
PBGA
Plastic Ball Grid Array
PLCC
Plastic Leaded Chip Carrier
PQFD
Plastic Quad Flat Pack
PQFP
Plastic Quad Flat Pack
PSOP
Plastic Small-Outline Package
QFP
Quad Flatpack
QSOP
Quarter Size Outline Package
SOIC
Small Outline IC
SOJ
Small-Outline Package [J-Lead]
SSOP
Shrink Small-Outline Package
TQFP
Thin Quad Flat Pack
TSOP
Thin Small-Outline Package
TSSOP
Thin Shrink Small-Outline Package
TVSOP
Thin Very Small-Outline Package
VQFB
Very-thin Quad Flat Pack

Through Hole Device

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Trough-hole mount packages.gif


C-DIP
Ceramic Dual In-line Package
CERDIP
Ceramic DIP
CPGA
Ceramic Pin Grid Array
DIP
Dual In-line Package
TBD
Dual In-line Zig-Zag Package;
HDIP
Hermetic DIP
PDIP
Plastic DIP [P-DIP]
PGA
Pin Grid Array;
PPGA
Plastic Pin Grid Array
Shrink DIP
Shrink Dual In-Line Package
SIP
Single In-line Package

Weitere Halbleitergehäusetypen

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Weblinks