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(→Through Hole Device) |
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==Gehäuse für integrierte Schaltungen, z.B. auch Mikrocontroller== | ==Gehäuse für integrierte Schaltungen, z.B. auch Mikrocontroller== | ||
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| + | ===Gehäuseklassen=== | ||
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| + | [[Bild:gehaeuseklassen.gif|center]] | ||
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[[Bild:Gehaeuseformen.gif|center]] | [[Bild:Gehaeuseformen.gif|center]] | ||
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===Surface Mount Device=== | ===Surface Mount Device=== | ||
[[Bild:package_plcc_small.jpg|center]] | [[Bild:package_plcc_small.jpg|center]] | ||
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| + | [[Bild:surface mount packages.gif|center]] | ||
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;BGA: Ball Grid Array | ;BGA: Ball Grid Array | ||
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;TVSOP: Thin Very Small-Outline Package | ;TVSOP: Thin Very Small-Outline Package | ||
;VQFB: Very-thin Quad Flat Pack | ;VQFB: Very-thin Quad Flat Pack | ||
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===Through Hole Device=== | ===Through Hole Device=== | ||
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[[Kategorie:Microcontroller]] | [[Kategorie:Microcontroller]] | ||
[[Kategorie:Elektronik]] | [[Kategorie:Elektronik]] | ||
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| + | ==Weitere Halbleitergehäusetypen== | ||
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| + | [[Bild:gehäusehalbleiter.jpg|center]] | ||
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| + | ==Weblinks== | ||
| + | * [http://www.standardics.philips.com/packaging/handbook/pdf/pkgchapter5.pdf Pdf Erläuterung wie Bauteile zu löten sind] | ||
Aktuelle Version vom 14. Mai 2006, 10:59 Uhr
Inhaltsverzeichnis
Gehäuse für integrierte Schaltungen, z.B. auch Mikrocontroller
Gehäuseklassen
Surface Mount Device
- BGA
- Ball Grid Array
- BQFP
- Bumpered Quad Flat Pack
- CBGA
- Ceramic Ball Grid Array
- CFP
- Ceramic Flat Pack
- CPGA
- Ceramic Pin Grid Array
- CQFP
- Ceramic Quad Flat Pack
- TBD
- Ceramic Lead-Less Chip Carrier
- DLCC
- Dual Lead-Less Chip Carrier (Ceramic)
- FBGA
- Fine-pitch Ball Grid Array
- fpBGA
- Fine Pitch Ball Grid Array
- JLCC
- J-Leaded Chip Carrier (Ceramic)
- LCC
- Leaded Chip Carrier [also Leadless]
- LCCC
- Leaded Ceramic Chip Carrier;
- LFBGA
- Low-Profile, Fine-Pitch Ball Grid Array
- LGA
- Land Grid Array [Pins are on the Motherboard, not the socket]
- MLCC
- Micro Leadframe Chip Carrier
- PBGA
- Plastic Ball Grid Array
- PLCC
- Plastic Leaded Chip Carrier
- PQFD
- Plastic Quad Flat Pack
- PQFP
- Plastic Quad Flat Pack
- PSOP
- Plastic Small-Outline Package
- QFP
- Quad Flatpack
- QSOP
- Quarter Size Outline Package
- SOIC
- Small Outline IC
- SOJ
- Small-Outline Package [J-Lead]
- SSOP
- Shrink Small-Outline Package
- TQFP
- Thin Quad Flat Pack
- TSOP
- Thin Small-Outline Package
- TSSOP
- Thin Shrink Small-Outline Package
- TVSOP
- Thin Very Small-Outline Package
- VQFB
- Very-thin Quad Flat Pack
Through Hole Device
- C-DIP
- Ceramic Dual In-line Package
- CERDIP
- Ceramic DIP
- CPGA
- Ceramic Pin Grid Array
- DIP
- Dual In-line Package
- TBD
- Dual In-line Zig-Zag Package;
- HDIP
- Hermetic DIP
- PDIP
- Plastic DIP [P-DIP]
- PGA
- Pin Grid Array;
- PPGA
- Plastic Pin Grid Array
- Shrink DIP
- Shrink Dual In-Line Package
- SIP
- Single In-line Package
Weitere Halbleitergehäusetypen
Weblinks
