Bauteile Gehäusebauformen: Unterschied zwischen den Versionen

Version vom 13. Mai 2006, 20:11 Uhr

Gehäuse für integrierte Schaltungen, z.B. auch Mikrocontroller

Ausschreibung der Abkürzungen

Surface Mount Device

BGA

Ball Grid Array

BQFP

Bumpered Quad Flat Pack

CBGA

Ceramic Ball Grid Array

CFP

Ceramic Flat Pack

CPGA

Ceramic Pin Grid Array

CQFP

Ceramic Quad Flat Pack

TBD

Ceramic Lead-Less Chip Carrier

DLCC

Dual Lead-Less Chip Carrier (Ceramic)

FBGA

Fine-pitch Ball Grid Array

fpBGA

Fine Pitch Ball Grid Array

JLCC

J-Leaded Chip Carrier (Ceramic)

LCC

Leaded Chip Carrier [also Leadless]

LCCC

Leaded Ceramic Chip Carrier;

LFBGA

Low-Profile, Fine-Pitch Ball Grid Array

LGA

Land Grid Array [Pins are on the Motherboard, not the socket]

MLCC

Micro Leadframe Chip Carrier

PBGA

Plastic Ball Grid Array

PLCC

Plastic Leaded Chip Carrier

PQFD

Plastic Quad Flat Pack

PQFP

Plastic Quad Flat Pack

PSOP

Plastic Small-Outline Package

QFP

Quad Flatpack

QSOP

Quarter Size Outline Package

SOIC

Small Outline IC

SOJ

Small-Outline Package [J-Lead]

SSOP

Shrink Small-Outline Package

TQFP

Thin Quad Flat Pack

TSOP

Thin Small-Outline Package

TSSOP

Thin Shrink Small-Outline Package

TVSOP

Thin Very Small-Outline Package

VQFB

Very-thin Quad Flat Pack

Through Hole Device

C-DIP

Ceramic Dual In-line Package

CERDIP

Ceramic DIP

CPGA

Ceramic Pin Grid Array

DIP

Dual In-line Package

TBD

Dual In-line Zig-Zag Package;

HDIP

Hermetic DIP

PDIP

Plastic DIP [P-DIP]

PGA

Pin Grid Array;

PPGA

Plastic Pin Grid Array

Shrink DIP

Shrink Dual In-Line Package

SIP

Single In-line Package