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Inhaltsverzeichnis
Gehäuse für integrierte Schaltungen, z.B. auch Mikrocontroller
Ausschreibung der Abkürzungen
Surface Mount Device
- BGA
- Ball Grid Array
- BQFP
- Bumpered Quad Flat Pack
- CBGA
- Ceramic Ball Grid Array
- CFP
- Ceramic Flat Pack
- CPGA
- Ceramic Pin Grid Array
- CQFP
- Ceramic Quad Flat Pack
- TBD
- Ceramic Lead-Less Chip Carrier
- DLCC
- Dual Lead-Less Chip Carrier (Ceramic)
- FBGA
- Fine-pitch Ball Grid Array
- fpBGA
- Fine Pitch Ball Grid Array
- JLCC
- J-Leaded Chip Carrier (Ceramic)
- LCC
- Leaded Chip Carrier [also Leadless]
- LCCC
- Leaded Ceramic Chip Carrier;
- LFBGA
- Low-Profile, Fine-Pitch Ball Grid Array
- LGA
- Land Grid Array [Pins are on the Motherboard, not the socket]
- MLCC
- Micro Leadframe Chip Carrier
- PBGA
- Plastic Ball Grid Array
- PLCC
- Plastic Leaded Chip Carrier
- PQFD
- Plastic Quad Flat Pack
- PQFP
- Plastic Quad Flat Pack
- PSOP
- Plastic Small-Outline Package
- QFP
- Quad Flatpack
- QSOP
- Quarter Size Outline Package
- SOIC
- Small Outline IC
- SOJ
- Small-Outline Package [J-Lead]
- SSOP
- Shrink Small-Outline Package
- TQFP
- Thin Quad Flat Pack
- TSOP
- Thin Small-Outline Package
- TSSOP
- Thin Shrink Small-Outline Package
- TVSOP
- Thin Very Small-Outline Package
- VQFB
- Very-thin Quad Flat Pack
Through Hole Device
- C-DIP
- Ceramic Dual In-line Package
- CERDIP
- Ceramic DIP
- CPGA
- Ceramic Pin Grid Array
- DIP
- Dual In-line Package
- TBD
- Dual In-line Zig-Zag Package;
- HDIP
- Hermetic DIP
- PDIP
- Plastic DIP [P-DIP]
- PGA
- Pin Grid Array;
- PPGA
- Plastic Pin Grid Array
- Shrink DIP
- Shrink Dual In-Line Package
- SIP
- Single In-line Package
